In addition to the ball collapse uniformity, any shorts can be pointed out through the examination of the x-ray image. The x-ray image in a BGA inspection process can also determine if anomalies such as the flowing of solder down the “dogbone” pattern of the contact to the via is disturbed.
Ever notice the media via TV, laptop, TABs and other digital gadgets is full of negative content? How is the media feeding this negativity to us and how is it lying on a daily basis? Read on to find out.